small signal product - low power loss, high current capability, low vf - surface device type mounting - moisture sensitivity level 1 - matte tin(sn) lead finish with nickel(ni) underplate - packing code with suffix "g" means green compound (halogen-free) - case: sod-123 small outline plastic package - molding compound, ul flammability classification rating 94v-0 - polarity: indicated by cathode band - weight: 0.01 g (approximately) symbol unit p d mw v rrm v v r v i o ma i frm a r ja o c/w t j o c t stg o c symbol units junction capacitance c j pf document number: ds_s1411004 version: c14 sd103aw thru sd103cw taiwan semiconductor low vf smd schottky barrier diode features sod-123 mechanical data - terminal: matte tin plated, lead free, solderable per mil-std-202, method 208 gua r - high temperature soldering guaranteed : 260c/10s maximum ratings and electrical characteristics (t a =25 unless otherwise noted) parameter sd103a w sd103b w sd103c w 50 30 20 reverse leakage current 5 a reverse breakdown voltage parameter typ max 125 300 1.5 350 28 21 14 40 400 mean forward current @ t l = 100c reverse voltage repetitive peak reverse voltage power dissipation v 0.37 v 0.60 40 @ t Q 1.0 s storage temperature range junction temperature thermal resistance ( junction to ambient ) -65 to +125 - - 20 30 v (br) v f i r v r = 0 , f = 1.0 mhz sd103cw v r = 10 v sd103bw v r = 20 v sd103aw v r = 30 v i f = 200 ma i f = 20 ma forward voltage - -- - repetitive peak forward surge current min sd103cw i r = 10 a sd103bw i r = 10 a sd103aw i r = 10 a
small signal product ratings and characteristics curves (t a =25 unless otherwise noted) document number: ds_s1411004 version: c14 sd103aw thru sd103cw taiwan semiconductor 0.01 0.1 1 10 100 1000 0.0 0.2 0.4 0.6 0.8 1.0 instantaneous forward current (a) instantaneous forward voltage (v) fig. 1 typical forward characteristics 0 0.07 0.14 0.21 0.28 0.35 0.42 0 25 50 75 100 125 150 i o , mean forward current (a) terminal temperature ( o c) fig. 2 forward current derating curve 0 50 100 150 200 250 300 350 400 450 0 25 50 75 100 125 150 power dissipation (mw) ambient temperature (c) fig. 3 fig. 3 admissible power dissipation curve 1 10 100 0 10203040 junction capacitance (pf) reverse voltage (v) fig. 4 typical junction capacitance
part no. note 1: "x" is device code from "a" thru "c". note 2: part no. suffix ?-xx ? would be used for special requirement part no. document number: ds_s1411004 version: c14 sd103aw thru sd103cw taiwan semiconductor small signal product ordering information part no. suffix (note 2) packing code packing code suffix package packing sd103xw (note 1) rh g sod-123 3,000 / 7" reel rf -xx example preferred part no. part no. suffix packing code packing code suffix description sd103aw rh sd103aw rh multiple manufacture source define manufacture source green compound sd103aw rhg sd103aw rh g multiple manufacture source green compound sd103aw-d0 rfg sd103aw -d0 rf g
small signal product package outline dimensions min max min max a 1.40 1.80 0.055 0.071 b 3.55 3.85 0.140 0.152 c 0.45 0.70 0.018 0.028 d 2.55 2.85 0.100 0.112 e 0.95 1.35 0.037 0.053 f 0.05 0.15 0.002 0.006 g h - 0.10 - 0.004 suggest pad layout a b c d marking part no. marking sd103aw s4 sd103bw s5 sd103cw s6 document number: ds_s1411004 version: c14 sd103aw thru sd103cw taiwan semiconductor sod-123 dim. unit (mm) unit (inch) 0.50 ref 0.02 ref dim. unit (mm) unit (inch) typ. typ. 1.22 0.048 2.36 0.093 4.19 0.165 0.91 0.036 b a e d c f g h
small signal product creat by art assumes no responsibility or liability for any errors or inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied,to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: ds_s1411004 version: c14 sd103aw thru sd103cw taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,
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